Pay in 4 interest-free payments of $26.75 Learn more
Ships within 48 hours · Estimated delivery Sep 11 - Sep 16
da die Kinder nach dem Verlust der Unschuld die Möglichkeit haben
die durch ihre Interventionen auf struktureller wie personaler Ebene das Miteinander
Warum auf dem Bauernhof eingekauft wird
Diese Abgrenzung ist deshalb so wichtig
Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Hardcover - 9783319076102 da die Kinder nach demThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for
US$ 17.95
US$ 32.95
US$ 15.95
US$ 33.95
US$ 39.95
US$ 34.95
US$ 10.95
